Topics & Tracks
SNUG India brings together leading industry experts to address the most impactful market verticals in semiconductor and systems innovation. We invite submissions that reflect advancements, challenges, and creative solutions within these domains. Share your insights and contribute to shaping the future of technology alongside Synopsys and our vibrant user community. To help you get started, we have prepared a preliminary list of topics, but don't let that limit your ideas or innovation:
Market Verticals:
AI & HIGH-PERFORMANCE COMPUTING (HPC)
- Explore the forefront of system design and innovation for advanced computing platforms supporting AI and machine learning workloads. Topics encompass next-generation compute architectures, performance optimization, scalable power and thermal management strategies, advanced interconnect and memory technologies, and robust design methodologies for both data center and edge deployments. This track also includes 3DIC and multi-die integration, enabling heterogeneous integration of processors, memory, and specialized accelerators to achieve higher bandwidth, density, and energy efficiency—critical for AI and HPC applications. Sessions will highlight Synopsys solutions that accelerate the development, verification, and integration of complex AI/HPC systems, addressing challenges in scalability, reliability, and performance.
FOUNDRY & MANUFACTURING
- Delve into manufacturing-centric design practices and collaborative foundry engagement to accelerate silicon success. Topics include TCAD-driven process and device modeling, advanced variability and yield analysis, reliability engineering, and leveraging manufacturing data for design enhancement across leading-edge and established process nodes. Gain insights into how early integration of manufacturing knowledge combined with Synopsys EDA solutions can drive higher quality, reduce risk, and accelerate time-to-market for semiconductor products.
SOFTWARE-DEFINED SYSTEMS
- Discover the convergence of hardware and software in the development of intelligent, connected systems. Topics focus on hardware–software co-design for automotive and autonomous platforms, system-level modeling, simulation-based validation (including Ansys tools and solutions), and methodologies to minimize integration risks through early virtual prototyping. Sessions will showcase Synopsys’ comprehensive tools and flows that enable rapid, reliable development of software-defined systems, from concept through deployment.
SILICON PROLIFERATION
- Examine the expanding influence of silicon innovation across emerging and diverse application domains. Topics cover vision computing, AR/VR platforms, domain-specific IP, and the integration of compute, sensor, and interface technologies. Emphasis is placed on scalable, reusable silicon building blocks and strategies for overcoming integration challenges. Learn how Synopsys solutions empower designers to accelerate product development, enhance interoperability, and unlock new possibilities in next-generation silicon-enabled systems.
Other Topics:
ANALOG/MIXED-SIGNAL DESIGN AND SIMULATION
- Enhancing Analog/Mixed-Signal Design and Simulation: Explore strategies for improving the robustness and efficiency of analog, custom, and mixed-signal designs using advanced verification, variability analysis, and integrated power/signal integrity tools. Share insights on RF analysis, minimizing design margins, accelerating design closure, and optimizing layout productivity with Synopsys tools.
DESIGN AND VERIFICATION IN THE CLOUD
- Enhancing Chip Development with Synopsys Cloud: Explore how Synopsys's cloud-native tools and automation optimize design and verification processes, balancing performance and cost while ensuring security. Share insights on migrating workflows to the cloud, focusing on resource optimization, simulation, timing analysis, and elastic CPU usage in physical verification.
DIGITAL DESIGN IMPLEMENTATION
- Optimizing Digital Design Implementation for Advanced Nodes: Drive innovation in advanced node designs by enhancing design flow, accelerating timing signoff, and achieving PPA targets. Collaborate with experts to refine convergence strategies, integrate early power analysis, and leverage physically aware ECO capabilities for superior outcomes.
ELECTRICAL LAYOUT VERIFICATION
- Enhancing Electrical Layout Verification for Robust Designs: Strengthen power device reliability and efficiency through comprehensive ESD verification, transient effect analysis, and advanced methodologies to ensure robust and reliable electrical layouts.
ENERGY-EFFICIENT SoCs
- Enhancing Energy Efficiency in Next-Generation SoCs: Explore cutting-edge strategies to optimize energy efficiency in SoCs, focusing on AI-driven power management, comprehensive hardware/software energy evaluations, and addressing the specialized power demands of smart edge devices and crypto chips.
MULTI-DIE DESIGN
- Driving Semiconductor Innovation with Multi-Die Designs: Explore the transformation from monolithic SoCs to multi-die designs with Synopsys' comprehensive and scalable solutions. Share insights on leveraging EDA tools and IP for early architecture exploration, rapid software development and validation, efficient die/package co-design, robust die-to-die connectivity, and improved manufacturing and reliability.
PHYSICAL VERIFICATION
- Accelerating Physical Verification for Complex SoCs: Optimize SoC integration by utilizing multi-CPU scalability for faster verification, managing dirty designs, and implementing shift-left strategies to enhance physical verification and repair processes.
SECURITY & SAFETY
- Enhancing Security and Safety in Chip Design: Explore strategies for reducing chip vulnerabilities through hardware, IP, and software approaches. Share insights on the role of SoC-based root of trust (RoT), leveraging industry standards for enhanced safety and security, and implementing functional safety in hardware and software. Discuss advanced methods for hardware security verification to ensure robust and secure designs.
SIGNOFF
- Accelerating Design Closure with Advanced Signoff Solutions: Explore how Synopsys' integrated design analysis and signoff solutions, including static timing analysis, power integrity, and parasitic extraction, enable designers to achieve the full performance-power-area (PPA) potential with a faster path to design closure. Share insights on leveraging these tools for efficient signal integrity, ECO closure, and transistor-level analysis.
SILICON TEST AND LIFECYCLE MANAGEMENT
- Optimizing Silicon Health with Lifecycle Monitoring and Analytics: Explore how Synopsys' integrated Silicon Lifecycle Management (SLM) solutions enhance silicon health and operational metrics throughout the device lifecycle. Share insights on leveraging in-chip observability, analytics, and automation to gather actionable data from silicon to system, enabling continuous analysis and feedback.
IP
- Accelerating Silicon Success with High-Quality IP: Explore how Synopsys' extensive IP portfolio, including logic libraries, embedded memories, and analog IP, enables faster and more efficient SoC designs. Share insights on leveraging Synopsys’ architecture design expertise, robust IP development, and comprehensive support to reduce integration risks and accelerate time-to-market.
SOFTWARE DEVELOPMENT & SYSTEM DESIGN [Hardware-Assisted Verification]
- Advancing Software Development and System Design: Explore topics such as accelerating software bring-up with emulation and prototyping, software-driven power analysis for GPUs and AI, and prototyping with real-world interfaces. Delve into large complexity prototyping, pre-silicon networking system validation, SoC performance validation using emulation, trust and hardware security verification, DFT-driven emulation, and prototyping approaches for 2.5D/3D heterogeneous integration.
VERIFICATION SOFTWARE
- Accelerating Verification Software: Explore how to verify the entire SoC early with Synopsys' industry-leading simulation, debug, and signoff tools, including VCS®, Verdi®, VC SpyGlass, and VC Formal™, alongside silicon-proven Verification IP and advanced virtual prototyping solutions.